US develops chip-scale, lightweight and affordable lidar sensor

China Instrument Network: Advancements in Chip-Scale Lidar Technology It has been reported that researchers at ASR Systems Inc. in California are working on developing compact, lightweight, and cost-effective light detection and ranging (LIDAR) sensors for military applications such as 3D imaging, penetrating photodetection, navigation, and telecommunications.

On March 4, an official from the U.S. Air Force Research Laboratory at Wright-Patterson Air Force Base in Ohio announced a $8.2 million contract with JASR Systems to develop chip-scale optical phased arrays and LIDAR systems. This project, known as the Modular Optical Aperture Building Block (MOABB), leverages technology from the Defense Advanced Research Projects Agency (DARPA).
The MOABB initiative was launched by DARPA in late 2015 to advance free-space optical technology for affordable, chip-level LIDAR sensors. These devices are extremely small, lightweight, and low-cost, but they offer faster beam scanning capabilities compared to traditional systems.
JASR Systems specializes in coherent and non-coherent computational imaging, high-performance optical systems, phased array LIDARs, millimeter-wave radar, microwave systems, advanced atmospheric simulation, and real-time graphics processing.
The goal of the MOABB project is to develop enabling technologies for integrated optics that can generate, amplify, transmit, and receive free-space optical radiation across a wide range of angles.
Several companies are involved in DARPA’s MOABB sensor program, including Lockheed Martin Coherent Technologies (LMCT) in Louisville, Colorado, TREX Enterprises in San Diego, California, Analog Photonics, Inc., in Hingham, Massachusetts, and Teledyne Scientific & Imaging in Thousand Oaks, California.
DARPA aims to build a two-dimensional millimeter-scale transmit/receive unit with a high fill factor aperture, non-mechanical beam steering, and integrated amplification using MOABB. This will allow tiling unit cells to create a large, coherent, high-power aperture.
One of the project's objectives was to develop a 10 cm transmit/receive coherent array with distributed gain using wafer-level processing technology and demonstrate it in a packaged LIDAR system for 3D imaging from 100 meters away.
According to DARPA scientists, free-space optical systems hold great potential for sensing, illumination, and communications. A 10 cm aperture can achieve an angular resolution of 0.001 degrees and an antenna gain of over 100 decibels.
These systems operate across a wide frequency range in the terahertz spectrum, enabling high-speed data transmission and sub-millimeter resolution 3D imaging. Additionally, the beams benefit from a wide low-atmospheric absorption window, allowing efficient remote propagation over open channels.
The applications of these technologies span various fields, including 3D imaging, penetrating LIDAR, navigation, and telecommunications.
Despite their capabilities, free-space optical systems often remain bulky, heavy, and costly. Above 10 cm, larger lenses, mirrors, mechanical components, and vacuum-based telescopes or imaging systems contribute to their size and weight.
For apertures below 10 cm, bulky mechanical joints are still needed to control telescopes and manage back-end optics like lasers and detectors.
To address this, the MOABB project seeks to leverage advancements in integrated photonics, which enable high-speed, non-mechanical beam control. Researchers believe that efficient sources, detectors, amplifiers, and low-loss waveguides can be fabricated on a flat platform, offering high power and large apertures.
Under the contract, JASR Systems will implement the project in Solana Beach, California, with completion expected by November 2020.
(Original title: Chip-Level LIDAR Sensor for 3D Imaging, Navigation, and Communication)

PVC RESIN SG3

There are many grades of PVC. The viscosity or K value commonly used in the industry indicates the average molecular weight (or average degree of polymerization) of PVC, that is, the length of the PVC molecular chain, which determines the grade of the resin and the corresponding processing parameters. The molecular weight of the resin is related to the physical and mechanical properties of the product.
PVC Resin is a kind of non-crystalline linear polymer compound. The larger the relative molecular mass, the higher the viscosity, the higher the molecular weight, and the higher the tensile strength, impact strength, and elastic modulus of the product, but the flow of the resin melt Decline in sex and plasticity. The viscosity number is usually used to indicate the molecular weight of the polymer, and the polymer model is divided

PVC used to be the largest general-purpose plastic in the world, and it is widely used. It is widely used in construction materials, industrial products, daily necessities, floor leather, floor tiles, artificial leather, pipes, wires and cables, packaging films, bottles, foam materials, sealing materials, fibers, etc

SG3 (K-70, S1300): mostly used for soft products, hoses, wires and cables, films, shoe materials, toys, auto parts etc.

PVC RESIN SG3 has high purity, less fish eyes, easy to blister, high temperature resistance, insulation, soft product texture, etc. It is mainly used to produce soft products such as wires and cables, agricultural films, conveyor belts, and daily plastic products.

PVC RESIN SG3,Pvc Resin Sg3 Sg5 Sg8,Pvc Resin K70,Pvc Resin Powder Sg3,Suspension Pvc Resin Sg3

Henan Shunbang Chemical Industry CO.,Ltd , https://www.pvcresinchemical.com